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Aligner

  • RA420L
    - Improve Throughput
    - Transparent Glass, bonding Wafer
  • RA320
    - Able to detect Transparent Glass, Notchless Wafer (L Type)
    - Small Size, Light Weight
    - Space-Saving
  • RA321
    - High Speed・High Precision
    - Improve Equipment’s Throughput (Equipped Buffer)
    - Able to detect Transplant Glass, Notchless Wafer with additional image sensor
  • RA120
    - Co-operation with Robot Arm
    - Only Spindle-Axis structure makes it compact
    - Scanning the Wafer by our own infrared sensor