연구개발

기술현황

레이저기술

  • Laser marking

  • Laser marking

  • In glass marking

  • Laser drilling

  • Glass drilling

  • Thick glass cutting (2t)

  • Thin glass cutting (0.3t)

  • 0.1t glass cutting

  • Stealth cutting

  • Polymer cutting

  • UTG cutting (0.03t)

  • Glass cutting

  • Thick glass cutting (2.8t)

  • LCD/OLED glass cutting

  • Tempered glass cutting

  • Film cutting

  • PET cutting

  • Laminated film cutting

인프라 기술 지원 분야 – 레이저 가공

피코초 / 나노초 / CO2 레이저 가공 시스템

Glass / Wafer/ Film / Ceramic / Metal 외 Cutting , Marking, Drilling 등 가공 평가 및 시스템 제공

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